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TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand
CNBC Technology · CNBC 科技09/08 16:32Semicap equipment · 半导体设备跟踪
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中文摘要
TSMC and Samsung will adopt ASML’s High NA EUV tools for advanced chipmaking as AI drives demand for smaller, more complex semiconductors.
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ASML
来源短摘录
TSMC and Samsung committed to using ASML’s High NA EUV lithography machines as demand for more advanced chips used in AI grows. Samsung plans to use High NA EUV in 2028 for DRAM memory manufacturing, while TSMC expects to adopt the technology in 2030 for advanced chips. ASML’s High NA EUV machines cost around $400 million, and investors see broader adoption of the technology as important to the chip equipment maker
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