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Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push - Euronext Markets: Real-time Stock Market Data | live

Euronext Markets: Real-time Stock Market Data | live07/25 17:41AI infrastructure · AI 算力基础设施观察

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Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push Euronext Markets: Real-time Stock Market Data | live

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SEOUL, July 25 (Reuters) - Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. Winning long-term production commitments from Broadcom, one of the world's leading custom AI chip designers, could boost utilisation at Samsung's advanced manufacturing facil

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