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Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push - CNBC
CNBC · CNBC 财经07/26 05:11AI infrastructure · AI 算力基础设施观察
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Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push CNBC
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Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030. Winning long-term production commitments from Broadcom, one of the world's leading custom AI chip designers, could boost utilization at Samsung's advanced manufacturing facilities to pull ahead in
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