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Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push - KWSN

KWSN07/26 15:49AI infrastructure · AI 算力基础设施跟踪

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Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push KWSN

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SEOUL, July 25 (Reuters) – Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until ‌2030. Winning long-term production commitments from Broadcom, one of the world’s leading custom AI chip designers, could boost utilisation at Samsung’s advanced manufacturing fac

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