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[News] TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom - TrendForce
TrendForce · 集邦咨询07/27 13:03Foundry supply chain · 晶圆代工供应链跟踪
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[News] TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom TrendForce
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[News] TSMC Scales 2nm Capacity as Samsung Wins Major AI Chip Deal with Broadcom Samsung has signed an MOU with Broadcom to collaborate across memory and foundry technologies, drawing industry attention to the evolving competitive landscape in the foundry business. According to Wccftech , while TSMC remains the undisputed leader in the global semiconductor market, Samsung’s vertically integrated turnkey strategy cou
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